Wafer industry

KEY PROJECTS

Descriptions

Wafer regeneration is the semiconductor IC manufacturing process, which will be used for process monitoring and Dummy wafer wafer recycling and reuse. The process feature uses ductile wheel grinding to replace the traditional grinding process to reduce the processing deterioration layer and reduce chemical pollution.
Wastewater characteristics
1. Grinding wastewater
2. Fluorine-containing wastewater
3.Ammonia nitrogen wastewater

Treatment technology:

  • Systematic mixed processing
  • Washing water recovery system
  • Grinding wastewater recovery system
  • Ammonia nitrogen treatment system (high gravity treatment system)
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